Student: Tanmay Dhanote
Committee: Dr. Konrad Rykaczewski
Abstract:
In the design of the electronic devices, thermal display, an artificial hand, haptic device, and wearable thermal system, understanding heat conduction in finger in contact with cooler or hotter objects is essential. In the most common experimental approach to study this process, a micro-thermocouple is placed at the finger-object interface and is used to measure the temporal changes of the so-called “contact temperature.” However, it is not clear what the contact temperature measured by the micro-thermocouple temperature represents—the exterior skin temperature, the substrate surface temperature, or a weighted average of the two? To answer this question, finite element analysis (FEA) is used in this project to analyze thermal transport in the thermocouple at the finger and cold substrate interface.
Zoom Room: https://asu.zoom.us/j/2376761712
Presentation Time: 12:00-1:00 PM (Arizona Time)
