Student: Kaustubh Alhad Joshi
Committee: Dr. Qiong Nian
Abstract:
Nanocomposite (NC) resins have demonstrated its capability to improve properties of parts fabricated by Digital Light Processing (DLP) additive manufacturing (AM) thus fostering their end use application. Nanodiamond (ND) filled acrylate polymers have observed significant improvement in thermal conduction of the NC. However, studies on DLP AM resins involving ND have been rarely found in literature. We conducted a novel study using concentrations as high as 10% W/vol of ND to achieve a 6.7% increase in Thermal Conductivity compared to bulk resin counterparts. Owing to limitations of DLP 3D printing, concentrations higher than 10% W/vol ND were not feasible & percolation threshold could not be surpassed. We have further discussed covalent functionalization of ND to achieve better interphase thickness between nanofillers & matrix. We anticipate this functionalization will achieve percolation even at lower concentrations while also aiding in other properties such as mechanical strength & thermal performance.
Zoom Room: https://asu.zoom.us/j/3499760838
Presentation Time: 12:00-1:00 PM (Arizona Time)
